Prepreg

Fiber weave effect: skew from the Dk gap between glass and resin in PCB laminates. Why it changes board to board and how to reduce it with your fab.

A Voltage Regulator Module is a power conversion component on a PCB that steps down input voltage to the precise levels required by processors, FPGAs, and other digital ICs.

Via-in-pad is a PCB design technique where vias are placed directly within component pads, enabling shorter trace lengths and tighter routing for fine-pitch components.

Via stitching is a PCB design technique where multiple vias connect ground planes across layers, reducing impedance, improving shielding, and enhancing signal return paths.

USB routing covers the PCB layout requirements for Universal Serial Bus interfaces, including impedance control, differential pair management, and connector pin-out considerations.

Turnkey PCB assembly is a full-service manufacturing model where a single provider handles everything from PCB fabrication and component procurement to assembly and testing.

A transmission line is a PCB trace that must be treated as a controlled-impedance structure when signal wavelengths approach the trace length, affecting all high-speed digital designs.

Trace routing is the process of drawing copper pathways on a PCB to create the electrical connections between components as defined by the circuit schematic.

Tombstoning is a PCB assembly defect where a small surface-mount component lifts on one end during reflow soldering, creating an open circuit caused by uneven thermal or solder conditions.

Time to market in hardware development is the total duration from initial design concept to product availability, where PCB layout is often the critical path bottleneck.

Through-hole technology is a PCB assembly method where component leads are inserted through drilled holes and soldered, providing strong mechanical bonds for connectors and high-power parts.

A thermal via is a plated through-hole placed beneath heat-generating components to conduct heat from the component pad through the board to internal copper planes or the opposite surface.

Thermal management in PCB design involves techniques to dissipate heat from electronic components, preventing overheating that can degrade performance or cause failure.

A test point is a designated location on a PCB providing access to a circuit node for electrical measurement, debugging, and automated in-circuit testing.

Surface Mount Technology is the predominant method of PCB assembly where components are soldered directly onto the board surface rather than through drilled holes.

A stripline is a PCB transmission line where a trace is routed between two reference planes, providing superior shielding and lower crosstalk compared to microstrip.

A solder paste stencil is a thin metal sheet with laser-cut apertures used to precisely deposit solder paste onto PCB pads before surface mount component placement.

Solder mask is the protective polymer layer applied over a PCB's copper traces that prevents solder bridges, protects against oxidation, and defines solderable areas.

Silkscreen is the printed text and symbol layer on a PCB surface that provides component reference designators, polarity markings, and assembly information for manufacturing and debugging.

Signal integrity refers to the quality of electrical signals as they travel across PCB traces, ensuring data arrives at its destination without distortion, noise, or timing errors.

Schematic capture is the process of creating the electronic circuit diagram that defines all components and their electrical connections before PCB layout begins.

SPICE simulation is the industry-standard method for predicting circuit behavior by mathematically modeling component characteristics and electrical interactions before physical prototyping.

Routing density measures how much of a PCB's available routing space is utilized by traces, a key metric for determining whether a design can be completed within the given board area and layer count.

A rigid-flex PCB combines rigid and flexible board sections in a single structure, replacing connectors and cables while enabling compact, reliable multi-board assemblies.

A return path is the route that signal current takes back to its source through the PCB ground or power plane, critical for signal integrity and EMI performance.

Reinforcement learning is an AI technique applied to PCB design where algorithms learn optimal placement and routing strategies by iterating through millions of design variations.

Reflow soldering is the primary PCB assembly process where solder paste is heated in a controlled oven profile to permanently attach surface-mount components to the board.

RF PCB design is the specialized discipline of laying out circuits that operate at radio frequencies, requiring precise impedance control, shielding, and electromagnetic management.

A power plane is a dedicated copper layer in a PCB stackup that distributes supply voltage to components, providing low-impedance power delivery across the board.

Power integrity is the discipline of ensuring stable, clean power delivery across a PCB, minimizing voltage drops, noise, and impedance that can cause circuit malfunction.

The Power Distribution Network is the complete system of planes, traces, vias, and capacitors that delivers clean, stable voltage from regulators to every component on a PCB.

A plated through hole is a drilled and copper-plated via that provides electrical connections between all layers of a PCB, the most common via type in circuit board manufacturing.

Pick and place is the automated manufacturing process where robotic machines position surface-mount components onto solder paste deposits on PCB pads at high speed.

Panelization is the process of arranging multiple PCB designs or copies onto a single manufacturing panel to optimize fabrication efficiency, reduce cost, and streamline assembly.

PCIe routing is the specialized PCB layout process for PCI Express high-speed serial interfaces, requiring precise impedance control, differential pair management, and AC coupling capacitor placement.

A PCB stackup defines the arrangement of copper and insulating layers in a printed circuit board, directly affecting impedance, signal integrity, power delivery, and manufacturing cost.

PCB prototyping is the process of fabricating and assembling a small batch of printed circuit boards to validate a design before committing to full production.

PCB layout is the process of physically arranging and connecting electronic components on a printed circuit board, transforming a schematic into a manufacturable design.

A PCB footprint (land pattern) defines the physical copper pad arrangement and dimensions on a circuit board that corresponds to a specific component's package for soldering.

PCB fabrication is the manufacturing process of creating the bare printed circuit board from raw materials, including copper etching, drilling, plating, and lamination.

PCB assembly is the process of soldering electronic components onto a fabricated printed circuit board, transforming a bare board into a functional electronic assembly.

ODB++ is an intelligent PCB data exchange format that packages complete design and manufacturing information in a single structured database, replacing traditional Gerber file packages.

A netlist is the data file that defines all electrical connections between component pins in a PCB design, serving as the bridge between schematic capture and physical layout.

A net class is a grouping of PCB nets that share common design rules such as trace width, clearance, and impedance targets, simplifying constraint management across complex designs.

Multi-board design is the practice of developing interconnected PCB assemblies where multiple boards work together within a system, requiring coordinated connector placement and signal routing.

Mixed-signal PCB design handles the unique challenge of combining analog and digital circuits on a single board while preventing noise coupling between the two domains.

A microvia is a small-diameter laser-drilled via connecting adjacent PCB layers, essential for high-density interconnect designs with fine-pitch BGA components.

A microstrip is a PCB transmission line configuration where a trace on an outer layer is referenced to an adjacent ground plane, commonly used for controlled-impedance routing.

Length matching is the PCB routing technique of equalizing trace lengths within a signal group to ensure simultaneous signal arrival, critical for high-speed parallel buses and DDR interfaces.

Layer assignment is the PCB design strategy of allocating specific signal types to specific copper layers in the stackup to optimize signal integrity, crosstalk isolation, and routing efficiency.

KiCad is a free, open-source PCB design software suite that provides professional-grade schematic capture, layout, and manufacturing output capabilities without licensing costs.

A keepout zone is a defined area on a PCB where components, traces, vias, or copper are restricted to prevent interference, maintain clearances, or satisfy mechanical constraints.

An impedance mismatch occurs when a PCB trace changes characteristic impedance at any point along its path, causing signal reflections that degrade high-speed data transmission.

Impedance control is the practice of designing PCB traces to maintain a specific characteristic impedance, critical for high-speed signal transmission and minimizing reflections.

An impedance calculator is a design tool that computes the required PCB trace width to achieve a target characteristic impedance based on stackup geometry and dielectric properties.

High-speed PCB design is a specialized discipline focused on managing signal integrity, timing, and electromagnetic effects in circuits operating at gigabit-per-second data rates.

HDI (High Density Interconnect) PCBs use microvias, fine traces, and advanced layer structures to achieve maximum routing density for compact, high-performance electronics.

A ground plane is a continuous layer of copper on a PCB dedicated to the ground reference, providing low-impedance return paths, EMI shielding, and thermal dissipation.

Gold fingers are the gold-plated edge connector pads on a PCB that provide a reliable, corrosion-resistant contact surface for plugging into a mating card-edge connector.

Gerber files are the industry-standard file format used to communicate PCB design data to fabrication houses, defining copper layers, solder mask, silkscreen, and drill patterns.

Flying probe testing is a PCB electrical verification method where motorized test probes move across the board to check connectivity and isolation without requiring a custom test fixture.

A flex PCB is a circuit board built on a flexible polyimide substrate that can bend and conform to curved enclosures, enabling compact designs in wearables, medical devices, and aerospace.

Fiducial markers are copper reference points on a PCB used by automated assembly equipment to precisely align the board for accurate component placement.

FR-4 is the most widely used fiberglass-reinforced epoxy laminate material for PCB fabrication, offering a balance of electrical insulation, mechanical strength, and cost.

Ethernet PCB design covers the layout requirements for wired networking interfaces from 100BASE-T to 100G Ethernet, including magnetics placement, impedance control, and EMC compliance.

Embedded components are passive or active electronic parts placed inside the PCB substrate layers rather than on the surface, reducing board size and improving high-frequency performance.

Electromagnetic simulation uses computational methods to predict how electric and magnetic fields behave on a PCB, validating signal integrity, EMC performance, and antenna behavior.

An Electrical Rule Check validates schematic-level connectivity and electrical correctness, catching wiring errors before the design moves to PCB layout.

Edge plating is a PCB fabrication process that applies a conductive copper layer to the board edge, used for grounding, shielding, and creating castellation connections.

ENIG (Electroless Nickel Immersion Gold) is a popular PCB surface finish that provides flat, solderable pads with excellent shelf life and compatibility with fine-pitch components.

EMI (Electromagnetic Interference) and EMC (Electromagnetic Compatibility) in PCB design address controlling unwanted electromagnetic emissions and ensuring circuits operate without interfering with other systems.

EDA (Electronic Design Automation) software is the category of tools used by engineers to design, simulate, and verify electronic systems including PCB layout, schematic capture, and SPICE simulation.

Differential pairs are two parallel PCB traces that carry complementary signals, used in high-speed interfaces like USB, HDMI, and Ethernet to reduce noise and improve signal integrity.

The dielectric constant is a material property of the PCB substrate that determines signal propagation speed and characteristic impedance, directly affecting high-speed design performance.

Design for Test is a set of PCB design practices that ensure a board can be efficiently tested during manufacturing, enabling automated fault detection and quality verification.

Design for Manufacturability (DFM) is a set of PCB design practices that ensure a board can be reliably fabricated, assembled, and tested at scale without defects or yield loss.

A Design Rule Check is an automated verification process that scans a PCB layout for violations of manufacturing and electrical constraints before fabrication.

Design reuse is the practice of leveraging proven circuit blocks, layouts, and component libraries from previous PCB designs to accelerate new product development.

A decoupling strategy is the systematic plan for selecting, placing, and connecting bypass capacitors across a PCB to maintain clean power delivery to all active components.

DDR routing is the process of laying out DDR memory interfaces on a PCB, requiring precise length matching, timing constraints, and impedance control for reliable high-speed data transfer.

Current carrying capacity defines the maximum current a PCB trace can safely conduct without exceeding temperature limits, determined by trace width, copper thickness, and thermal environment.

Crosstalk is the unwanted coupling of electromagnetic energy between adjacent PCB traces, causing signal distortion and noise that can lead to data errors in high-speed designs.

Copper weight specifies the thickness of copper foil on each PCB layer, measured in ounces per square foot, affecting current capacity, trace width, and thermal performance.

A copper pour is a large area of copper fill on a PCB layer that typically serves as a ground or power plane, improving shielding, thermal dissipation, and return path quality.

A controlled impedance PCB is a board manufactured with specific trace geometries and stackup tolerances to achieve target characteristic impedance values required by high-speed interfaces.

Conformal coating is a protective polymer layer applied to assembled PCBs that shields components and traces from moisture, dust, chemicals, and temperature extremes.

Component placement is the process of positioning electronic parts on a PCB to optimize signal integrity, thermal performance, manufacturability, and routing efficiency.

Clock distribution is the PCB design challenge of routing clock signals to all components that need them while maintaining timing accuracy, signal integrity, and minimal skew.

Castellated holes are half-plated vias along the edge of a PCB module that enable it to be soldered onto a carrier board as a surface-mount component.

Cadence Allegro is an enterprise-grade PCB design platform used for the most complex high-speed, multi-layer board designs in aerospace, networking, and semiconductor industries.

A bypass capacitor (decoupling capacitor) is placed near IC power pins on a PCB to filter high-frequency noise and provide local charge reserves for stable power delivery.

A buried via connects two or more inner layers of a PCB without reaching either outer surface, maximizing routing density in high-layer-count designs.

A board respin is a PCB design revision that requires new fabrication, typically triggered by functional errors, manufacturing issues, or component changes discovered after the initial build.

A blind via connects an outer PCB layer to one or more inner layers without penetrating the entire board, enabling higher routing density in complex designs.

A Bill of Materials (BOM) is the comprehensive list of all components required to build a PCB assembly, including part numbers, quantities, values, and supplier information.

Back drilling is a PCB fabrication process that removes unused via stubs to reduce signal reflections and improve high-speed performance in multi-layer boards.

BGA fanout is the PCB routing strategy for escaping signal traces from the dense pin array of a Ball Grid Array package to outer routing channels and vias.

An autorouter is a software tool that automatically creates trace connections between PCB components, but traditional autorouters often lack physics awareness and require significant manual cleanup.

Aspect ratio in PCB design is the ratio of a via's depth to its diameter, a critical manufacturing parameter that determines via reliability and fabrication feasibility.

An annular ring is the copper pad area surrounding a drilled via or through-hole on a PCB, critical for reliable electrical connections and manufacturing yield.